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Project Ownership: Ravi Shah

Github Link (Main Board): https://github.com/lhr-solar/DataAcq-EnvironmentBoardBOM Link: WIP

Github Link (Breakout): https://github.com/lhr-solar/DataAcq-EnvBreakoutPCB

BOM Link: https://www.mouser.com/ProjectManager/ProjectDetail.aspx?AccessID=8fef7b51e5

Info

For production use (on the car), each main environment board will interface with a breakout board containing relevant sensors to the system being monitored. Wire harnessing should minimize the distance between the main board and the breakout to prevent noise. Main boards will be connected via EnvironmentCAN to each other and to the Data Acquisition leader board.

Description/Purpose

Measure environmental data throughout the car, including relative humidity, airflow, and temperature (see

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Data Acquisition SRR for more rationale)

Physical

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  • Discuss form factor and mounting with Cooling

    • Talked to Kaden Nguyen 10/12/24

      • Airflow sensor needs to be exposed - preferably back of board

      • Humidity/temp can be anywhere

      • Make as small as possible around PSOM

      • Mounting holes on corners

  • Airflow only one direction - can have stuff on the other side of flow sensor

  • Does not need to be waterproof

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Design

  • Each node consists of a main environment board + sensor breakout board

  • Main environment board - interfaces with a PSOM (Peripheral System on Module) to provide ADC, I2C, and CAN functionality; connects to breakout board via short (TODO: absolute wire size/constraints after testing) wire

  • Sensor breakout board - implements exposed humidity, airflow, and temperature sensors with all passive components and a connector to interface with the main environment board

  • Modularity - can pick and choose which sensors to use on each breakout board during assembly

    • Not all sensors need to be present at every node

Rationale

  • The sensor breakout board needs to be as small as possible to not disrupt airflow in the intake, exhaust, battery box, etc. (according to Cooling/Emech)

  • The main board has to be at least the size of PSOM + any connector footprints, which is too large to place in the cooling system

    • Decided to break out sensors onto a separate board to balance airflow and data integrity

  • Airflow sensor needs an uninterrupted flow of air to measure accurately - no other components can be placed in the line of measurement

  • Humidity/Temperature sensors must also be exposed to the environment that’s being monitored

Interface

  • Main environment board

    • Sends environmental data to the Data Acquisition leader board via internal EnvironmentCAN

    • Will then be sent over TelemetryCAN to the telemetry module??

  • Modularity: Can pick and choose which sensors to use on each board during assembly – doesn’t require all sensors to be present

  • TODO: breakout system

    • TVS for i2c, fuse, connectors

    • pinouts for connectors on board silkscreen if also using for logic analzer debug points TODO: Need clarification on this

  • Sensor breakout board

    • Receives sensor power and ground from the main board

      • All power connections are fused on the main board using PTC (resettable) fuses for overcurrent protection

    • Sends/receives I2C and Analog signals to/from the main board

      • Each I2C line on the main board is protected from ESD (transient voltage spikes) using TVS diodes

  • I2C Repeater - https://www.nxp.com/products/interfaces/ic-spi-i3c-interface-devices/ic-bus-repeaters-hubs-extenders/level-translating-ic-bus-smbus-repeater:PCA9509

    • May be needed to reduce noise on I2C signal lines due to a large distance between the main board and the breakout

Context

Location of the board: Several boards Boards will be located utilized by several systems throughout the car as outlined below

  • Cooling:

    • Nose Intake, Tail Exhaust, Battery box intake/exhaust, internally in battery box multiple locations

  • any TODO: Any other systems needing environmental sensing TBD

Discussed with Parthiv Shah 10/26/24

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Intake/Exhaust (cooling ducts)

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Inside battery box

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Form Factor

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PSOM daughterboard with connectors (<4cm) for breakouts (sensor + passives) as to not disrupt airflow

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PSOM daughterboard with SMD components

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Temperature

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(tick)

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(tick)

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Humidity

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(error)

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(tick)

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Airflow

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(tick)

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(error)

Connection List

#

Name

Type

Ideal Voltage

Notes

U4

Daughterboard PSOM Connector

53307-2471 (PSOM)

N/A

3.65mm tall

J2

CAN Output

1x4xP3.00mm_PolarizingPeg_Vertical

+12V

6.98mm tall

J3

CAN Input

1x4xP3.00mm_PolarizingPeg_Vertical

+12V

6.98mm tall

J6

Breakout

2x05_P2.50mm_Vertical

+3.3V

9.05mm tall

PeripheralSOM Daughterboard Connection List

Pin #

Net Name

Notes

2, 9

+3.3V

General 3.3V source for SHT45 humidity sensor and FS3000 airflow sensor

4, 11

GND

Ground associated with general 3.3V source

6

I2C2_SDA

I2C data signal for FS3000 airflow sensor

8

I2C2_SCL

I2C clock signal for FS3000 airflow sensor

10

VDDA (3.3V)

Isolated 3.3V analog voltage source for LMT87 temperature sensor

12

GNDA

Isolated analog ground for LMT87 temperature sensor

14

I2C1_SCL

I2C clock signal for SHT45 humidity sensor

16

I2C1_SDA

I2C data signal for SHT45 humidity sensor

20

PA1 (ADC)

STM32 analog-to-digital converter input on PSOM; connected to analog output of LMT87 temperature sensor

21

CAN_L

CAN Bus Low; connected to other Environment boards and Leader board over EnvironmentCAN

22

+12V_In

12V input from CAN I/O connector

23

CAN_H

CAN Bus High; connected to other Environment boards and Leader board over EnvironmentCAN

24

GNDPWR

Ground associated with 12V from CAN I/O connector

Note

I2C2 jumpers on Peripheral SOM PeripheralSOM must be closed for pull-up functionality (default is open for GPIO)

Main

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Schematic

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Sensor Schematics

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Note

R1 and C6 C7 values were chosen arbitrarily due to lack of documentation, need to test/verify

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Protection for Breakout Board

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Main Board Connectors

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Breakout Connector

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List of Circuit Components

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  • Description: Digital relative humidity and temperature sensor

  • Justification for selection of specific part: ?? DataAcq chose it

  • Datasheet link: https://sensirion.com/media/documents/33FD6951/662A593A/HT_DS_Datasheet_SHT4x.pdf

  • Associated passives/components:

    • 100nF capacitor

    • 2x 10k resistors

  • Interface: I2C

  • Footprint: weird footprintNon-standard QFN

    Should work for driver development/testing
  • Notes:

    • 3.3v supply voltage

    • Maximal power-up time = 1ms

    • Also measures temperature – not using this functionality due to modular nature of board

    • Heater functionality provided for high humidity (>90%RH) conditions

    • Accurate to ±1.0 %RH

Airflow Sensor – https://www.mouser.com/ProductDetail/Renesas-Electronics/FS3000-1005?qs=xZ%2FP%252Ba9zWqYVrq1uDYsQug%3D%3D

Temperature Sensor – https://www.ti.com/product/LMT87

CAN IC (WIP)

Need input on chip to use - or do we need it?

  • Description:

  • Justification:

  • Datasheet link:

  • Associated passives/components:

  • Interface:

  • Notes:

12v to 3.3v step-down (WIP)

Need input on converter - do we even need this on the board?

  • Description:

  • Justification:

  • Datasheet link:

  • Associated passives/components:

  • Interface:

  • Notes:

Connectors (WIP)

  • PSOM (53307-2471 connector)

  • Power from CAN

  • EnvironmentCAN

    • TODO

Layout (WIP)

Dimensions:

Requirements/Constraints: TODO (From mech/emech/cooling)

Design Choices (WIP)

PCB (WIP)

3D Model (WIP)

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TVS Diodes - https://www.mouser.com/ProductDetail/863-ESD9B3.3ST5G

  • Description: Transient voltage suppressor (TVS) diode to protect sensitive components from ESD

  • Justification for selection of specific part: Sufficient working peak reverse voltage and breakdown voltage to protect broken-out I2C devices (sensors)

  • Datasheet link: https://www.onsemi.com/pub/Collateral/ESD9B-D.PDF

  • Footprint: SOD-923

  • Notes:

    • VRWM (Working Peak Reverse Voltage) of 3.3v

    • VBR (Breakdown Voltage) of 5v

PTC Fuses - https://www.mouser.com/ProductDetail/530-0ZCM0010FF2G

Layout

Dimensions: 59mm x 53mm (Main board), 27.2mm x 19.4mm (Breakout board)

Requirements/Constraints: As described in the rationale section.

PCB

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3D Models

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Firmware (WIP)

Test setup: Nucleo-F429ZI

TODO: add documentation for the following

  • CRC calculation for SHT45

  • checksum calculation for FS3000

  • drivers for SHT45, FS3000, LMT87

  • CAN package information

  • build/test instructions